Please use this identifier to cite or link to this item: https://elib.psu.by/handle/123456789/2907
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dc.contributor.authorBrinkevich, D.-
dc.contributor.authorVabishchevich, N.-
dc.contributor.authorVabishchevich, S.-
dc.contributor.authorPetlitski, A.-
dc.contributor.authorProsolovich, V.-
dc.contributor.authorYankovskii, Yu.-
dc.date.accessioned2014-06-19T11:03:34Z-
dc.date.available2014-06-19T11:03:34Z-
dc.date.issued2013-
dc.identifier.citationBrinkevich, D.I., Vabishchevich, N.V., Vabishchevich, S.A. et al. Physical and mechanical properties of silicon near the SiO2/Si interface. J. Synch. Investig. 7, 1217–1220 (2013). https://doi.org/10.1134/S1027451013060256ru_RU
dc.identifier.otherhttp://link.springer.com/article/10.1134%2FS1027451013060256-
dc.identifier.otherhttp://www.maikonline.com/maik/showArticle.do?auid=VAHNR0MSBS&lang=ru-
dc.identifier.urihttps://elib.psu.by/handle/123456789/2907-
dc.description.abstractThe influence of an oxide coating on the strength characteristics of single-crystal silicon surface layers is investigated by the microindentation method. It is shown experimentally that a strengthened layer with a thickness of 0.2–0.4 μm and a microhardness of 20–35 GPa, which is two or three times as much as the microhardness of bulk single-crystal silicon, is present near the SiO2/Si interface. The thickness and microhardness of this layer depends on the growth conditions of the oxide. The formation of this layer is most probably caused by interstitial silicon atoms formed near the SiO2/Si interface during silicon oxidation.ru_RU
dc.language.isoenru_RU
dc.publisherSpringerru_RU
dc.subjectФизикаru_RU
dc.subjectкремнийru_RU
dc.subjectсвойства кремнияru_RU
dc.subjectSiO2/Siru_RU
dc.subjectsiliconru_RU
dc.titlePhysical and mechanical properties of silicon near the SiO2/Si interfaceru_RU
dc.title.alternativeФизико-механические свойства кремния вблизи границы раздела SiO2/Siru_RU
dc.typeArticleru_RU
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